Products > Micro scriber, Wafer contact angle, wafer stress measurement + Contact angle measuring systems > SURFTENS WH 300
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.
New: with SECS/GEM Interface!
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Product Description
Product video
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Product Description
SURFTENS WH 300 is a fully automatic contact angle measuring instrument, equipped with 3-axis wafer handling robot, loadport for 300mm wafers and complete functionality as requesetd in 300mm wafer technology.
Since 2020 a SECS/GEM interface is implemented.
The SECS / GEM interface supports the semi-standards E30, E84 / 87, E90, E40 and E94 and thus enables control jobs, process jobs, substrate tracking, carrier management and the OHT connection.
GENERAL SOFTWARE
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3 user levels |
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connection to SPC via network interface card |
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operating system Windows XP/7 |
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automatic loadport recognition |
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automatic recognition of slot occupancy |
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automatic measurement recipes assigned to certain load port (recipe mix up between different wafer sizes is avoided) |
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slot integrity is warranted |
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notching before measurement |
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Measurement data will be stored on local disc – any backup storage on network server will be organized by customer |
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LAN compatible |
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Client software for result evaluation on office PC is included |
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Manual operation mode (via joystick) |
MEASUREMENT GENERAL
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Automatic, motorized dosing and drop placement System |
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10 ml Syringe for one media (DI-water) |
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Tank for DI water with automatic refill of syringe |
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Programmable droplet size |
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Automatic placement of the droplet on the wafer, movement for droplet placement is programmable |
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System capable for measurements with second liquid |
Image: Tool inside setup showing wafer roboter and dosing system
MEASUREMENT
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Tool/Software supports free definable measurement maps |
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The whole wafer surface for 12« must be in reach for the dispense system (excluding edge area) |
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Complete automatic measurement (FOUP -› droplet placement -› measurement -› droplet removal -› FOUP) |
GENERAL HARDWARE
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Wafer handling capability for 12« wafer / and or 8« wafers |
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System guarantees slot integrity |
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Manual focus system, OEG provides detailed instruction for focus adjustment |
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OEG provides concept for maintenance, spare parts, complete users guide |
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OEG provides instruction for change of syringe |
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Wafer chuck only defined by measurement characteristics |
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Air pressure, vacuum, exhaust is provided by customer |
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Customer provides 300mm wafers plus FOUPs for development system setup |
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After measurement liquid will be evaporated by hotplate (optional) |
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Work place contains keyboard and mouse |
TOOL CONFIGURATION
Configuration - unit description:
1) Wafer handling system
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3-axis wafer handling robot |
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FOUP opening system 300 mm |
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Loadport (OCL) 200 mm |
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Laser scanner |
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Vacuum endeffector |
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Notching system |
2) SURFTENS contact angle measuring module
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3-axis-step motor |
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stepping motor driven wafer table |
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automatic dispense system |
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automatic droplet positioning (teachable) |
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CCD camera with optics |
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Fan Filter Unit (FFU, on customer request) |
Technical Parameters for contact angle measurement
Contact angle measuring device SURFTENS 300 WH for the fully automatic measurement of the wetting behavior of solids (e.g. wafers or glass substrates for flat panel displays) under clean-room conditions, as well as for series tests and systematic analysis. The SURFTENS automatic enables the reduction of subjective factors and time involved for contact angle measurements in research, quality- and production inspection.
SURFTENS 300 WH features the software-controlled measurement and analysis of:
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contact angle according to the sessile drop method, |
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the wetting behavior on solid surfaces |
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the surface free energy of solids and their components |