Optical metrology · Software development · Image processing

Optical metrology · Software development · Image processing

  • Welcome

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    • Optics Test Equipment

    • Measuring systems for drawing dies and punches

    • Drawing die and wire measurement

    • Contact angle measuring systems

    • Micro scriber, Wafer contact angle, wafer stress measurement

    • Straightness, Flatness, Positioning uncertainty by autocollimator

    • Measuring microscopes, Image processing

    • Flatness, Bow, Warp, Curvature, Glass thickness

    • Measuring systems for image intensifier tubes (IIT)

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Exhibitions

OPIE 25, 23.-25- april 2025, Pacifico Yokohama

Laser World of Photonics

SEMICON Europe 2025

OPIE 25, 23.-25- april 2025, Pacifico Yokohama

 

The exhibition will be held from 04/23/2025 to 04/25/2025 from 10:00 to 17:00 at Pacifico Yokohama.

 

As a trade exhibition for optics and photonics-related industries, OPIE is the largest exhibition in Japan. Every April, at the beginning of the new fiscal year, engineers and buyers looking for solutions to R&D and product development problems visit the exhibition.

 

You can find us at booth R36 of our agent FIT Leadintex.

What we exhibit

Precision wafer scriber MR200

 

 

SURFTENS basic-contact angle measuring system: low cost, high performance

 

 

 

Laser World of Photonics

We’re looking forward to meeting in person again at Messe Munich.

 

 

 

 

 

 

 

We present our products for measuring optical parameters such as MTF, focal length, back focal length, and all types of imaging errors.

 

 

We show our new autocollimation sensor, which works completely without a cable connection.

 

 

 

 

SEMICON Europe 2025

SEMICON Europa 2025 is co-located with Productronica exhibition in Munich, Germany creating the strongest single event for electronics manufacturing in Europe and broadening the range of attendees across the electronics chain.

 

 

We are looking forward to welcome you at our booth C1370

Fully automatic measuring devices with wafer robot, load port and SECS/GEM interface for the measurement of contact angle.

 

 

New!

Additional module for SURFTENS WH for the measurement of Edge Bead removal (EBR).

This means that SURFTENS WH 300 offers the possibility of combining two measurement functions in a single device, which previously required two devices. Lower investment and less space required in the clean room therefore pay off immediately for the customer.